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Engineering - D315AO 5G (AGX Orin/AGX Orin Industrial, Fan)

Overview Download
Where to Buy

D315AO 5G

Applies to NVIDIA® Jetson AGX Orin (32GB / 64GB) & AGX Orin Industrial module

  • 1x M.2 B key for 4G & 5G, 1x M.2. E key for Wi-Fi 6E and 1x M.2. M key for SSD and capture

  • 120-pin highspeed connector for MIPI SerDes cameras, such as GMSL2/FPD-link III/V-by-One® HS, to deploy in AMRs application

  • 1x GbE & 1x 10G RJ-45 ethernet for dozens of IP cameras streaming simultaneously in smart security application

  • 10GigE Vision camera connector for smart inspection and 1x PCIe slot for multi-function expansion

  • Operating temperature: -25°C ~ 70°C

  • Dimension: 141.5mm(W) x 133.5mm(L) x 63mm(H)

Overview

 

AVerMedia Engineering Kit D315AO 5G built with NVIDIA® Jetson AGX Orin & AGX Orin Industrial module, which brings next-level AI performance and power-efficient capability for all autonomous machines. This optional SoM makes advanced analytics possible while providing the ability to handle a host of other embedded IoT applications.

 

D315AO 5G includes a 120-pin high-speed connector for connecting MIPI SerDes cameras, which can fulfill the demand for AMRs. In addition, a sufficient Ethernet bandwidth with 10G is excellent for applying smart security, enabling dozens of IP cameras to stream simultaneously. The connector for the 10GigE Vision Camera is also great for smart inspection. Lastly, with its compact size, D315AO 5G furnishes a PCIe slot for multi-function expansion and excellent compatibility with 5G and Wi-Fi 6.

Key Industries

 

AVerMedia devices are built with flexibility in mind and are designed for the following verticals.

AMRs

 

AMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth.

Smart Security

 

Smart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety.

Smart Inspection

 

Smart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production.

Specifications

Model

D315AO 5G

Type

Engineering Kit

NVIDIA GPU SoC Module Compatibility

NVIDIA® Jetson AGX Orin (32GB / 64GB) & AGX Orin Industrial module

Networking

•1x GbE RJ-45

•1x 10G RJ-45

Display Output

1x HDMI output

 

Temperature

•Operating temperature -25°C~70°C

•Storage temperature -40°C ~ 85°C

•Relative humidity 40 °C @ 95%, Non-Condensing

MIPI Camera Inputs (Internal)

GMSL2/FPD-link III/V-by-One® HS (STURDeCAM20 optional)

 

USB

•1x USB 2.0 Micro-B for recovery

•2x USB 2.0 Type-A

•2x USB 3.2 Type-A

Storage

1x micro-SD card slot

 

 

 

Expansion Header

•40-pin (UART, SPI, CAN, I2C, I2S, GPIOs )

•1x M.2 B key (for 4G LTE module or 5G module)

•1x M.2 E key  (for Wi-Fi 6E)

•1x M.2 M key (for SSD or AVerMedia capture card:  CN311-H, CN312SW, CN312MW)

•1x Micro SIM socket

•1x PCIe x16 (only support x8 PCIe lanes)

•1x CAN bus with transceiver

•120-pin (for MIPI SerDes)

•OOB support (only Power ON/OFF)

 

Power requirement

Voltage DC 12V~54V

Current DC in JACK on board: 7A Max

ATX 4pin: 10.8A Max

Power Cord

US/JP/EU/UK/TW/AU/CN

Thermal Solution

Fan 

Buttons

Power and Recovery

RTC Battery

Support RTC battery and battery life monitoring by MCU

PCB/Electronics Mechanical Info

141.5mm(W) x 133.5mm(L) x 63mm(H)

Weight: 720g

Certifications

CE, FCC, KC

Ordering Information

Model

SKU Number

Equip NVIDIA SOM

D315AO (5G)

D315AO-32G-003

AGX Orin 32G

D315AO (5G)

D315AO-64G-004

AGX Orin 64G

D315AO (5G)

D315AO-64G-005

AGX Orin 64G Industrial

Optional Accessories

Wi-Fi Module

M.2 E key 2230

Intel® Wireless-AC 9260、Intel® Wi-Fi 6E AX210

SSD

M.2 M key 2280

256GB

 

 

Capture Card

M.2 M key 2280

1x SDI; 1x HDMI

2Kp60 in (SDI), 1920 x 1200p60 in (HDMI), 1080p out

M.2 M key 2280

2x SDI

2Kp60 in - 1080p out

M.2 M key 2280

1x HDMI

4096 x 2160p30 in and out

4G LTE Cat4

M.2 B key 3042

Quectel EM05-G

5G

M.2 B key 3052

Quectel RM520N-GL

DOWNLOAD

Datasheet
Datasheet
Datasheet
BSP for Orin Nano
BSP Version Update
Mechanical
BSP for AGX Orin
BSP for Orin NX
FAQ
2D drawing
Source code
3D drawing
Datasheet
Driver
User Manual
BSP for Nano
BSP for NX
BSP for TX2 NX
SDK and Capture Studio
BSP

Date : 2025-05-07 00:00:00

 
OS Version Compatible SoMs Release Note
L4T r36.4.3 (Jetpack 6.2) AVERMEDIA_JETPACK-R1.1.4.6.2.0 (Beta)

AGX Orin
Orin NX & Orin Nano
Orin Nano Super Mode
Orin NX Super Mode

ReadMe

Date : 2025-02-28 00:00:00

 
OS Version Compatible SoMs Release Note
L4T r36.4.3 (Jetpack 6.2) AVERMEDIA_JETPACK-R1.1.0.6.2.0 (Beta) AGX Orin
Orin NX & Orin Nano
Orin Nano Super Mode
ReadMe

Date : 2025-02-25 00:00:00

     
OS Version Release Note
L4T r35.6 (Jetpack 5.1.4) D315AO-R2.6.0.5.1.4 ReadMe

Date : 2024-11-13 00:00:00

     
OS Version Release Note
L4T r36.4 (Jetpack 6.1) D315AO-R3.2.0.6.1.0 (beta) ReadMe

Date : 2025-02-25 00:00:00

Comparison table of all product lines

Date : 2024-11-01 00:00:00

5G Set Datasheet

Date : 2024-11-01 00:00:00

4G Set Datasheet

Date : 2024-10-07 00:00:00

     
OS Version Release Note
L4T 35.4.1 (Jetpack 6.0) D315AO-R3.1.3.6.0.0 ReadMe

Date : 2024-05-28 00:00:00

     
OS Version Release Note
L4T 35.4.1 (Jetpack 5.1.3) D315AO-R2.5.2.5.1.3 ReadMe

Date : 2024-04-29 00:00:00

D315AO(5G)_3D Drawing

Date : 2024-04-29 00:00:00

D315AO(5G)_2D Drawing

Date : 2024-12-31 00:00:00

D315 5G-User Manual

Date : 2024-02-29 00:00:00

D315AO 5G-Datasheet
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  • Products
    • Embedded Systems by Type
      • Carrier Board
      • Box PC
      • Engineering Kit
      • Peripheral
    • Embedded Systems by Jetson Module
      • AGX Orin
      • Orin NX/Orin Nano
      • AGX Xavier
      • Nano
      • Xavier NX
      • TX2 NX
    • Frame Grabbers
      • M.2
      • Mini
      • PCIe
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  • Vision Solution
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